ILFA CAD layouts
ILFA CAD layouts
More than just connecting dots.
Our CAD services are a great help to you en route from an idea via a schematic, a layout, a PCB and solder paste stencil to assembling your module. We offer you expert support in realising your products. If you wish you can consult us in the very early stages of your product planning.
We will draft the technically and financially most promising solution with you and support you from the development stage of the assembled prototype all the way to series maturity.
Our standard services include
the CAD design,
layout documentation,
production documentation (in Gerber + Excellon),
the commented net list,
long-term data storage (> 10 years),
producing the PCB prototype/s,
elaborating of the production tools.
The production tools include preparing a photoplot (conductor pattern, solder resist mask, assembly, solder paste stencil, carbon print mask, Via Print mask, heat sink paste, etc.), the CNC programmes for drilling, milling and scoring as well as the programmes for electronic PCB testing and adaptor design.
The documentation of our CAD layouts is complete and meets international standards.
Supplementary services
Cross sections (thickness dimensions, layer construction)
Expertises (layer build-up)
Impedance measurements (metrology protocols)
Solder paste stencils (laser cut)
Soldering paste stencils (glued in screen frames)
Module assembly
We also offer assembly of your modules either by our contractors or us. You can of course choose a module assembly service yourself.
We will coordinate the necessary times and dates for you.
Printed circuit boards (PCBs)
All the PCBs using CAD layouts drafted by us are also made by us. Producing the prototypes we also elaborate all the necessary tools. In the event of a follow-on order these tools are then available in-house and no extra costs are hence incurred.
Our PCB production department is available for smaller and medium-sized series (and for special orders). Larger series are available from our contractors and us.
Working interactively
We work interactively on layout design. This yields consistent continuous optimisation of module placement and conductor routing from the first to the last conductor line.
Our component libraries are regularly and intensively updated and their PCB technology is hence always state-of-the-art.
CAD systems
We use the following CAD systems.
"Supermax ECAD" (former Dansk Data Electronics, now Mentor Graphics)
"PADS PowerPCB" (former Innoveda, now Mentor Graphics).
"Protel" (Altium)
"Mentor Expedition" (Mentor Graphics, via Fa. IDS)
Technological spectrum
Your layout may be single-, double-sided or multilayer.
PCB classes
PCB design in all currently usual PCB classes is available. This includes:
flexible PCBs (with reinforcement if desired),
standard rigid PCBs,
and rigid-flex PCBs.
Possible surfaces
A wide variety of surfaces is available for you to choose from as your module assembly dictates:
Chemical tin (immersion tin)
Chemical gold (immersion gold)
Galvanic gold (electroplated gold)
Bonded gold (chemical + galvanic)
Copper (OSP, entek+)
Hot Air Levelling (with/without lead)
Chemical silver (immersion silver)
Material
All standard PCB basic materials are available for you to choose from:
FR 3
FR 4 (with differing TG values)
CEM
BT
PD (polyimide)
PTFE (Teflon) with ceramic or other reinforcement
Impedance
We will plan suitable layer construction should impedances have to be considered as well as calculating the required conductor widths and spacings for you.
In multilayer types we will also check the entire construction concept regarding possible production engineering influencing factors.
All standard impedance models are available:
Single-ended impedance
Differential impedance
Coplanar impedance
Coplanar-differential impedance
Impedance-defined PCBs using CAD layouts drafted by ILFA will of course be measured by us before leaving our works.
Selective vias
We can apply any modern via variant if desired in design optimisation of complex layouts (HDI):
Blind Vias
Buried Vias
Microvias
Multilayer construction
Meeting complex CAD layout specifications is often only possible in multilayer constructions specially selected to meet those specifications or even newly designed to do so.
Multilayers can be designed with internal or external cores. Sequential designs are feasible too.
In addition to designing homogenous multilayer PCBs of FR4 materials hybrid designs are possible as are designs made entirely of special materials.
UTMs
For particularly thin multilayer designs UTMs (Ultra Thin Multilayer boards) can be used in which the distance between adjacent layers is not more than 50ym.
Installing 50ym cores in multilayer PCBs makes it possible to achieve design optimisation through broadband decoupling effects and embedding MPS (MultiPowerSystems) within the multilayer.
Cross sections (thickness dimensions, layer construction)
Expertises (layer build-up)
Impedance measurements (metrology protocols)
Solder paste stencils (laser cut)
Soldering paste stencils (glued in screen frames)
Module assembly
We also offer assembly of your modules either by our contractors or us. You can of course choose a module assembly service yourself.
We will coordinate the necessary times and dates for you.
Printed circuit boards (PCBs)
All the PCBs using CAD layouts drafted by us are also made by us. Producing the prototypes we also elaborate all the necessary tools. In the event of a follow-on order these tools are then available in-house and no extra costs are hence incurred.
Our PCB production department is available for smaller and medium-sized series (and for special orders). Larger series are available from our contractors and us.
Working interactively
We work interactively on layout design. This yields consistent continuous optimisation of module placement and conductor routing from the first to the last conductor line.
Our component libraries are regularly and intensively updated and their PCB technology is hence always state-of-the-art.
CAD systems
We use the following CAD systems.
"Supermax ECAD" (former Dansk Data Electronics, now Mentor Graphics)
"PADS PowerPCB" (former Innoveda, now Mentor Graphics).
"Protel" (Altium)
"Mentor Expedition" (Mentor Graphics, via Fa. IDS)
Technological spectrum
Your layout may be single-, double-sided or multilayer.
PCB classes
PCB design in all currently usual PCB classes is available. This includes:
flexible PCBs (with reinforcement if desired),
standard rigid PCBs,
and rigid-flex PCBs.
Possible surfaces
A wide variety of surfaces is available for you to choose from as your module assembly dictates:
Chemical tin (immersion tin)
Chemical gold (immersion gold)
Galvanic gold (electroplated gold)
Bonded gold (chemical + galvanic)
Copper (OSP, entek+)
Hot Air Levelling (with/without lead)
Chemical silver (immersion silver)
Material
All standard PCB basic materials are available for you to choose from:
FR 3
FR 4 (with differing TG values)
CEM
BT
PD (polyimide)
PTFE (Teflon) with ceramic or other reinforcement
Impedance
We will plan suitable layer construction should impedances have to be considered as well as calculating the required conductor widths and spacings for you.
In multilayer types we will also check the entire construction concept regarding possible production engineering influencing factors.
All standard impedance models are available:
Single-ended impedance
Differential impedance
Coplanar impedance
Coplanar-differential impedance
Impedance-defined PCBs using CAD layouts drafted by ILFA will of course be measured by us before leaving our works.
Selective vias
We can apply any modern via variant if desired in design optimisation of complex layouts (HDI):
Blind Vias
Buried Vias
Microvias
Multilayer construction
Meeting complex CAD layout specifications is often only possible in multilayer constructions specially selected to meet those specifications or even newly designed to do so.
Multilayers can be designed with internal or external cores. Sequential designs are feasible too.
In addition to designing homogenous multilayer PCBs of FR4 materials hybrid designs are possible as are designs made entirely of special materials.
UTMs
For particularly thin multilayer designs UTMs (Ultra Thin Multilayer boards) can be used in which the distance between adjacent layers is not more than 50ym.
Installing 50ym cores in multilayer PCBs makes it possible to achieve design optimisation through broadband decoupling effects and embedding MPS (MultiPowerSystems) within the multilayer.