For catalogues of printed circuit board types, for the CAD-Layout documentation and the assignment of particular process sequences within the production
Non-plated holes (NPTHs) on multi layered printed circuit boards do not absorb any solder in the solder bath. Therefore, the hole barrel remains open and
The PCBs are directly connected to mother boards by PC-plugs. We distinguish between PC-AT-plugs with a raster pitch of 2.54mm and PCI-plugs with a raster
The PCB designations serve as an identification of the PCB. Indispensable are: a.) the company's name or logo
Peelable solder resist is a thermally hardening 1-component lacquer which is applied by screen printing.
By means of the galvanotechnical plating process, several levels of a printed circuit board are electrically connected by via holes or outer areas.
Powerplanes ensure the power supply of the circuit on the PCB. Due to the large metal area, powerplanes have also heat carryingoff and shielding effects.
By pressing in plugs, solder-free connections for plated printed circuit boards (double-sided or multilayer) are possible.
Printed circuit boards are distinguished according to their type, the material used and due to their mechanical features.
The registration system ensures the exact adjusting and alignment of the production films according to the correct side. It determines the positioning of the
CAD data are processed by the CAM of the PCB-manufacturer by means of different coordinate transformations for the production of printed circuit boards. The
The screen printing is used to apply a lacquer structure on the surface of the board. The following is printed: a.) Conductive patterns (for patterns >
The Sieb&Meyer data contain the information on the hole coordinates of a CAD layout. The Sieb&Meyer format is a standard file structure which makes the data
Solder resist is a thermally hardening lacquer applied by screen printing (2-component epoxy resin lacquer) on the board or phototechnically structured after
Solder paste stencils are used for the application of the solder paste before the assembly of SMDs. In this chapter, only stencils produced by laser are