ILFA design rules for multilayer    
ILFA PCBs
General design rules
LEGEND STANDARD HIGH END (ON REQUEST)
Max. PCB dimensions 420x570mm On request
Thickness multilayer A 0.3 - 4.2mm On request
Metallized holes & milled cut-outs (details refer to the diameter of the drilling tool)
Drilling tool diameter Possible deviation with press-fit technology Specified end diameter + 100 µm On request
Through hole 1 Aspect ratio 1:8, minimum Æ 100 µm Aspect ratio 1:10, minimum Ø 100 µm
Through hole, plugged and capped ¹ 2 Aspect ratio 1:8, minimum Ø 150 µm Aspect ratio 1:10, minimum Ø 100 µm
Blind via 3 Aspect ratio 1:1, minimum Ø 100 µm Aspect ratio 1:1.2, minimum Ø 100 µm
Blind via, plugged and capped ¹ 4 Aspect ratio 1:1, minimum Ø 150 µm Aspect ratio 1:1.2, minimum Ø 150 µm
Buried via, plugged or resin filled ¹ Depending on layout and Ø 5 Aspect ratio 1:8, minimum Ø 150 µm Aspect ratio 1:10, minimum Ø 100 µm
Buried via, plugged and capped ¹ 6 Aspect ratio 1:8, minimum Ø 150 µm Aspect ratio 1:10, minimum Ø 100 µm
Stacked via 7 Aspect ratio 1:1, minimum Ø 150 µm Aspect ratio 1:1.2, minimum Ø 150 µm
Edge metallizations 8
Conductive pattern / remnant annular rings
Trace width on inner & outer layers (µm) Depending on copper thickness B Without plugging ≥75 with plugging ≥100 Without plugging ≥50 with plugging ≥75
Conductor spacing on inner & outer layers (µm) Depending on copper thickness C Without plugging ≥75 with plugging ≥100 Without plugging ≥50 with plugging ≥75
Annular ring between end-Ø inner and outer layers (µm) D ≥150 On request
Distance from hole to hole (µm) Based on end- Ø E ≥300 On request
Distance bore to adjacent conductive pattern (µm) Based on end- Ø F ≥250 On request
Overlap of edge metallization on outer layer (µm) On inner layer recommended G ≥300
Distance of conductive pattern to milling contour (µm) H ≥300 ≥100
Distance from hole to milling contour (µm) Based on end- Ø I ≥400 On request
Soldermask
Soldermask fillet width (µm) Depending on solder mask type, colour, copper thickness J ≥80 ≥70
Soldermask clearance to copper (µm) K ≥50 ≥25
Soldermask overlap solder mask defined pads (µm) L ≥50 ≥25
Soldermask clearance of edge metallization (µm) M ≥100 On request
Soldermask clearance via / component bore unplugged (µm) N ≥70 On request
Other options are possible. Your layer structure is not standard? We will be happy to help you.
¹Plugging is possible from a circuit board thickness of ≥0.3 mm excl. copper thickness. PCBs with external, flexible base materials, or materials without glass fabric cannot be plugged.
VERSION: ILFA DM 1

Download design rules for multilayer here.