| ILFA design rules for multilayer | ||||
|---|---|---|---|---|
| ILFA PCBs General design rules |
LEGEND | STANDARD | HIGH END (ON REQUEST) | |
| Max. PCB dimensions | 420x570mm | On request | ||
| Thickness multilayer | A | 0.3 - 4.2mm | On request | |
| Metallized holes & milled cut-outs (details refer to the diameter of the drilling tool) | ||||
| Drilling tool diameter | Possible deviation with press-fit technology | Specified end diameter + 100 µm | On request | |
| Through hole | 1 | Aspect ratio 1:8, minimum Æ 100 µm | Aspect ratio 1:10, minimum Ø 100 µm | |
| Through hole, plugged and capped ¹ | 2 | Aspect ratio 1:8, minimum Ø 150 µm | Aspect ratio 1:10, minimum Ø 100 µm | |
| Blind via | 3 | Aspect ratio 1:1, minimum Ø 100 µm | Aspect ratio 1:1.2, minimum Ø 100 µm | |
| Blind via, plugged and capped ¹ | 4 | Aspect ratio 1:1, minimum Ø 150 µm | Aspect ratio 1:1.2, minimum Ø 150 µm | |
| Buried via, plugged or resin filled ¹ | Depending on layout and Ø | 5 | Aspect ratio 1:8, minimum Ø 150 µm | Aspect ratio 1:10, minimum Ø 100 µm |
| Buried via, plugged and capped ¹ | 6 | Aspect ratio 1:8, minimum Ø 150 µm | Aspect ratio 1:10, minimum Ø 100 µm | |
| Stacked via | 7 | Aspect ratio 1:1, minimum Ø 150 µm | Aspect ratio 1:1.2, minimum Ø 150 µm | |
| Edge metallizations | 8 | |||
| Conductive pattern / remnant annular rings | ||||
| Trace width on inner & outer layers (µm) | Depending on copper thickness | B | Without plugging ≥75 with plugging ≥100 | Without plugging ≥50 with plugging ≥75 |
| Conductor spacing on inner & outer layers (µm) | Depending on copper thickness | C | Without plugging ≥75 with plugging ≥100 | Without plugging ≥50 with plugging ≥75 |
| Annular ring between end-Ø inner and outer layers (µm) | D | ≥150 | On request | |
| Distance from hole to hole (µm) | Based on end- Ø | E | ≥300 | On request |
| Distance bore to adjacent conductive pattern (µm) | Based on end- Ø | F | ≥250 | On request |
| Overlap of edge metallization on outer layer (µm) | On inner layer recommended | G | ≥300 | |
| Distance of conductive pattern to milling contour (µm) | H | ≥250 | ≥100 | |
| Distance from hole to milling contour (µm) | Based on end- Ø | I | ≥400 | On request |
| Soldermask | ||||
| Soldermask fillet width (µm) | Depending on solder mask type, colour, copper thickness | J | ≥80 | ≥70 |
| Soldermask clearance to copper (µm) | K | ≥50 | ≥25 | |
| Soldermask overlap solder mask defined pads (µm) | L | ≥50 | ≥25 | |
| Soldermask clearance of edge metallization (µm) | M | ≥100 | On request | |
| Soldermask clearance via / component bore unplugged (µm) | N | ≥70 | On request | |
| Other options are possible. Your layer structure is not standard? We will be happy to help you. | ||||
| ¹Plugging is possible from a circuit board thickness of ≥0.3 mm excl. copper thickness. PCBs with external, flexible base materials, or materials without glass fabric cannot be plugged. | ||||
| VERSION: ILFA DM 3 | ||||