ILFA design rules for multilayer  
ILFA PCBs
General design rules
LEGENDSTANDARDHIGH END (ON REQUEST)
Max. PCB dimensions420x570mmOn request
Thickness multilayerA0.3 - 4.2mmOn request
Metallized holes & milled cut-outs (details refer to the diameter of the drilling tool)
Drilling tool diameterPossible deviation with press-fit technologySpecified end diameter + 100 µmOn request
Through hole 1Aspect ratio 1:8, minimum Æ 100 µmAspect ratio 1:10, minimum Ø 100 µm
Through hole, plugged and capped ¹2Aspect ratio 1:8, minimum Ø 150 µmAspect ratio 1:10, minimum Ø 100 µm
Blind via3Aspect ratio 1:1, minimum Ø 100 µmAspect ratio 1:1.2, minimum Ø 100 µm
Blind via, plugged and capped ¹4Aspect ratio 1:1, minimum Ø 150 µmAspect ratio 1:1.2, minimum Ø 150 µm
Buried via, plugged or resin filled ¹Depending on layout and Ø5Aspect ratio 1:8, minimum Ø 150 µmAspect ratio 1:10, minimum Ø 100 µm
Buried via, plugged and capped ¹6Aspect ratio 1:8, minimum Ø 150 µmAspect ratio 1:10, minimum Ø 100 µm
Stacked via7Aspect ratio 1:1, minimum Ø 150 µmAspect ratio 1:1.2, minimum Ø 150 µm
Edge metallizations8
Conductive pattern / remnant annular rings
Trace width on inner & outer layers (µm)Depending on copper thicknessBWithout plugging ≥75 with plugging ≥100Without plugging ≥50 with plugging ≥75
Conductor spacing on inner & outer layers (µm)Depending on copper thicknessCWithout plugging ≥75 with plugging ≥100Without plugging ≥50 with plugging ≥75
Annular ring between end-Ø inner and outer layers (µm) D≥150On request
Distance from hole to hole (µm)Based on end- ØE≥300On request
Distance bore to adjacent conductive pattern (µm)Based on end- ØF≥250On request
Overlap of edge metallization on outer layer (µm)On inner layer recommendedG≥300
Distance of conductive pattern to milling contour (µm)H≥250≥100
Distance from hole to milling contour (µm)Based on end- ØI≥400On request
Soldermask
Soldermask fillet width (µm)Depending on solder mask type, colour, copper thicknessJ≥80≥70
Soldermask clearance to copper (µm)K≥50≥25
Soldermask overlap solder mask defined pads (µm)L≥50≥25
Soldermask clearance of edge metallization (µm)M≥100On request
Soldermask clearance via / component bore unplugged (µm)N≥70On request
Other options are possible. Your layer structure is not standard? We will be happy to help you.
¹Plugging is possible from a circuit board thickness of ≥0.3 mm excl. copper thickness. PCBs with external, flexible base materials, or materials without glass fabric cannot be plugged.
VERSION: ILFA DM 3

Download design rules for multilayer here.