ILFA, together with the TU Berlin, has received approval for the implementation of a new ZIM cooperation project. The abbreviation ZuLLei stands for the project title: "Reliable, heterogeneous printed circuit board technology for embedded power semiconductors". Within the framework of this two-year project, which started on 01.02.2018, the twist and warpage of printed circuit boards with embedded components will be analyzed more in detail.

When embedding components in the printed circuit board, the layer stack is often structurally asymmetrical. The result is in the worst case, a strong warping, which complicates the subsequent processes such as SMD assembly and leads to bad product quality. The project investigates and models the interactions of the heterogeneous materials involved in the design in order to both optimize the processes and support the design process. For this purpose, abstracted thermo-mechanical simulation models will be developed at TU Berlin in order to be able to influence reliability-relevant parameters early on in the design process. At the end, an application-oriented demonstrator will be manufactured.

In the cooperation project, ILFA is developing its own embedding technology, which is in increasing demand, as well as further insights into design specifications, material selection and process parameters for asymmetrical structures.