- Absorbent power supply system in PCBs
- CPU-Modul CERO
- Data File Format: Gerber
- Flexible and Rigid Flex PCBs
- HDI Printed Circuit Boards
- ILFACool
- Impedance PCBs - FED
- Influence of etch-back on the impedance of conductor paths
- Laser Direct Imaging
- Multilayer Systems
- PCB Handbook
- Status And Future Of The PCB
- Super-microfine-line Technology
- The Future of the PCB
- The PCB 2010 - The Finale.
- UTMs
- Via Plugging
- Vias
- Workshop: Impedance and multilayer
Publications
Workshop: Impedance and multilayer
Developers and designers of high-frequency circuitry know that they must calculate the impedance of printed conductors and allow for it in drafting CAD layouts. What is less well known is that in many standard digital circuits the impedance of printed signal conductors and the power supply increasingly play a role that is functionally de-cisive. The reason for this lies in the shorter switching times (signal rising edge) of modern modules.
Workshop-Impedance,multilayer.pd