- Absorptives Stromversorgungssystem in Leiterplatten
- Bohrungen
- Das CPU-Modul CERO
- Datenformate: Gerber
- Die Leiterplatte 2010 - Das Finale
- Einfluss der Rückätzung auf die Impedanz von Leiterzügen
- HDI Leiterplatten
- ILFACOOL
- Impedanzdefinierte Leiterplatten - Erste Ergebnisse der FED-/VdL-Projektgruppe „Design"
- Laserdirektbelichtung
- Mikrofeinstleitertechnik
- Multilayersysteme
- Multilayersysteme und Chip in Board
- Pluggen
- UTM's
- Wohin geht die Leiterplatte ?
- Workshop: Impedanzen und Multilayer
Publikationen
Status And Future Of The PCB
The trend in the PCB industry is evident: printed circuit boards will become more complex, more sensitive to thermal and mechanical stress and more expensive.
This overview of the essential aspects which influence the production of multilayer boards indicates the range of materials, galvanic surface-finishes, mechanical treatments and image structures available. In addition, it illustrates the essential organisational principles that must be considered if the construction and specification of a PCB is to be successful.
This overview of the essential aspects which influence the production of multilayer boards indicates the range of materials, galvanic surface-finishes, mechanical treatments and image structures available. In addition, it illustrates the essential organisational principles that must be considered if the construction and specification of a PCB is to be successful.
publications_status_and_future_o