- Absorbent power supply system in PCBs
- CPU-Modul CERO
- Data File Format: Gerber
- Flexible and Rigid Flex PCBs
- HDI Printed Circuit Boards
- ILFACool
- Impedance PCBs - FED
- Influence of etch-back on the impedance of conductor paths
- Laser Direct Imaging
- Multilayer Systems
- PCB Handbook
- Status And Future Of The PCB
- Super-microfine-line Technology
- The Future of the PCB
- The PCB 2010 - The Finale.
- UTMs
- Via Plugging
- Vias
- Workshop: Impedance and multilayer
Publications
Via Plugging
The CAD layout of a SMD Fine Pitch module is a challenge in itself. The pending processors in µBGA housings will make the challenge even greater. Sequential drilling strategies such as Blind Vias and Buried Vias make life easier but involve restrictions as well. A Blind Via under a BGA ball is extremely unpopular with PCB assemblers as they rightly fear exploding soldering points during the reflow process and hence defective connection reliability.
The problem is known but there was to date no answer. This now seems to have been found. After fine and very fine, multilayer, UTM, rigid-flex and microvia technology etc. we have the tireless creativity of PCB manufacturers to thank once again for there now being no further obstacle in the way of electronic miniaturisation.
The magic word is – via plugging -.
The problem is known but there was to date no answer. This now seems to have been found. After fine and very fine, multilayer, UTM, rigid-flex and microvia technology etc. we have the tireless creativity of PCB manufacturers to thank once again for there now being no further obstacle in the way of electronic miniaturisation.
The magic word is – via plugging -.
Plugging.pdf