ILFA - What's cooking:

We are familiar with all up to date Technology, to support you in the best way with the production of your printed circuit boards. The activity portfolio of ILFA comprises all CAD services to create the design of prototypes, small series as well as the development of large-scale production. The services include the fabrication of individual production tools and the management of documentation and longtime data storage. We permanently optimize our production methods and used materials because we already want to be prepared for the future of your products.

Our technologies:

  • Rigid, flexible and rigid-flexible PCBs
  • Ultra-thin multilayers
  • Blind, buried, stacked vias / plugging
  • Impedance controlled PCB
  • Microfine-line boards up to 50 µm Embedded component
  • Integrated Micro Cooling System for PCB‘s
  • HF- and power technique
  • EMV aligned PCBs
  • Material-Hybrid-Layouts
  • PCB edge metallization
  • Single-sided and double-sided boards
  • Electro optical circuit boards
  • Multilayer up to 32 layers


An overview of our services:

  • CAD services to layout PCB designs
  • Layout assessment
  • Prototypes and smaller series
  • Larger series with ILFA certified partners or alignment of all processes with manufacturers chosen by customer
  • Assembling of PCBs via partners
  • Documentation and date storage for a minimum of 10 years
  • Creation of testing protocols
  • Analysis and testing processes in our own laboratories
  • Scan service for not digitalized films and creation of Gerber data


We provide the manufacturing of:

  • Single-sided PCBs
  • Double-sided PCBs
  • Multilayer PCBs of up to 32 layers
  • Flexible and rigid-flexible PCBs
  • Microfine line PCBs
  • Blind and Buried Vias
  • Liquid-cooled multilayer PCBs (ILFACOOL)
  • Impedance-controlled PCBs

All basic materials are available:

  • FR 3
  • FR 4 (with differing TG values)
  • CEM
  • BT
  • PD (polyimide)
  • PTFE (Teflon, ceramic)

The following surfaces are available:

  • Chemical tin (immersion tin)
  • Chemical gold (immersion gold)
  • Galvanic gold (electroplated gold)
  • Bonded gold (chemical & galvanic)
  • Copper (OSP, entek+)
  • Chemical silver (immersion silver)