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| Max. board dimensions | | 420x570mm | on request |
| Thickness single and double sided (mm) | | 0.5/0.8/1.0/1.2/1.55/2.0 | 0.05 to 3.2 |
| Tolerance single and double sided | | acc. IPC 4101 Cl. B/L | acc. IPC 4101 Cl. C/M, more on request |
| Thickness multilayer | | 0.3 - 4.2mm | on request |
| Tolerance multilayer | (thickness ≥1.0mm) | ± 10% | on request |
| (thickness <1.0mm) | ± 0.1mm | on request |
| Prepreg (fabric style) | | 106/1080/2113/2116/7628 | on request |
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| ILFA copper thickness | | |
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| On inner layer (µm) | | 17/35 | 5/9/12/70/105/210/300/400/500 |
| On outer layer (µm) | | 17/35/70/105 | on request |
| In via-hole (µm) | | ≥20µm | on request |
| In blind vias (µm) | >150µm end-Ø | acc. IPC 6012 | on request |
| In micro vias (µm) | ≤150µm end-Ø | acc. IPC 6012 | on request |
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| ILFA finish | | |
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| Solder mask | type | Lackwerke Peters 2467 (green) | blue, red, black, white, transparent |
| coverlay | DuPont Pyralux FR | DuPont Pyralux LF, more on request |
| Solder mask thickness | on conductor edge (µm) | minimum 5 | |
| on track (µm) | 5 to 40 | |
| on base material (µm) | 10 to 55 | |
| Legend print | inkjet print | Taiyo IJR-4000 (white) | |
| screen printing, wet film resist | not applicable | yellow, black, white |
| Final surface | | ENIG (electroless Ni/Au), HAL lead and lead-free, immersion Sn, OSP (Glicoat SMD F2) ENIG with TRG (electroless Ni/Au semi reductive), ENEPIG (electroless Ni/Pd/Au), immersion Ag, galv. Ni/Au (partial), galv. connector gold, carbon conductive print, heat sink print, peelable soldermask | on request |
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| ILFA design basics | | |
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| Conductor width min. (µm) at copper thickness [µm] | | 75 [17], 125 [35], 150 [70] | 50 [17], 75 [35], 130 [70], 400 [210] |
| Conductor spacing min. (µm) at copper thickness [µm] | | 75 [17], 125 [35], 150 [70] | 60 [17], 85 [35], 140 [70], 400 [210] |
| Circular annular ring to end-Ø inner layer (µm) | | ≥150 | on request |
| Circular annular ring to end-Ø outer layer (µm) | | ≥150 | on request |
| Min. fillet width (µm) | on copper | 80 (depending on copper thickness) | |
| on basic material | 80 (depending on copper thickness) | |
| Line width legend print (µm) | | 80 | |
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| ILFA drilling and routing technique | |
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| Smallest end-Ø (mm) | mechanical | 0.100 | on request |
| laser | 0.050 | on request |
| Aspect ratio (drilling -Ø to PCB-thickness) | via-hole | ≥ 1 : 8 | on request |
| blind via | ≥ 1 : 1 | on request |
| Tolerance end-Ø (mm) | DK | +0.10/-0.05 | on request |
| NDK | ±0.05 | on request |
| Tolerance routed contour (mm) | | ±0.20 | on request |
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| ILFA positioning accuracy | | |
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| Outline (routed) to drilling pattern (mm) | | ±0.200 | on request |
| Outline (routed) to image pattern (mm) | | ±0.200 | on request |
| V-cut outline to image pattern (mm) | | ±0.200 | |
| Hole to hole - common clamping (mm) | | ±0.050 | |
| Drilling (NPTH) 2nd clamping (mm) | | ±0.200 | |
| Drilling pattern (PTH) to image pattern (mm) | | ±0.050 | on request |
| Drilling pattern (NPTH) to image pattern (mm) | | ±0.200 | on request |
| Image pattern to solder resist (mm) | | ±0.050 | on request |
| Min. V-cut fillet | | ±0.100 | |
| Warp / twist | symmetrical ML 1 | ≤0.75% | on request |
| asymmetrical ML | on request | on request |
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| ILFA certificates and guidelines | |
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| DIN ISO EN 9001:2008 | | certified compliance to IPC 6010-Series | |
| DIN ISO EN 14001:2009 | | certified compliance to IPC A-600 | |
| UL-Recognized US/Canada | file no.: E132781 | certified compliance to IPC SM-840 | |
| Certified IPC member | no.: 1292020 | conflict-free sourcing initiative | CMRT on request |
| | RoHS-conform 2 | |
| 1 Standard for THM-Circuit boards according to IPC 6012: ≤ 1.5% |
| 2 Not for final surface HAL lead plated | VERSION: ILFA TC 1 |
