| ILFA PCB's: General design rules | LEGEND | STANDARD | HIGH END (ON REQUEST) | |
|---|---|---|---|---|
| Max. PCB dimensions | 420x570mm | On request |
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| Thickness of flexible area over all | A | ≥0.065 mm (single sided) , ≥0.10 mm (double sinded) | On request |
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| Thickness of reinforced connector area | B | ≥0.10 mm - 0.50 mm , Tolerance +/- 30 µm ≥ 0.50 mm , Tolerance +/- 10% | ||
| Metallized holes & milled cut-outs (details refer to the diameter of the drilling tool) |
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| Drilling tool diameter | Specified end diameter + 100 µm | On request |
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| Through hole | 1 | Aspect Ratio 1:8, minimum Ø 75 µm | Aspect Ratio 1:10, minimum Ø 50 µm |
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| Blind Via (from top or bottom) | 2 | Aspect Ratio 1:1, minimum Ø 75 µm | Aspect Ratio 1:1,2, minimum Ø 50 µm | |
| Conductive pattern / remnant annular rings |
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| Trace width min. (µm) | Depending on copper thickness | C | ≥75 | ≥50 |
| Conductor spacing min. (µm) | Depending on copper thickness | D | ≥75 | ≥50 |
| Annular ring to drilling tool-Ø (µm) | E | ≥100 | ≥75 |
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| Distance from hole to hole (µm)¹ | Based on drilling tool-Ø | F | ≥100 | |
| Distance of conductive pattern to milling contour (µm) | G | ≥300 | ≥100 |
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| Distance of metallized hole to milling contour (µm) | Based on drilling tool-Ø | H | ≥350 | ≥200 |
| Overlap of coverlay with solder mask (µm) | Only in a combined type | I | 300 | On request |
| Solder mask / coverlay |
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| Solder mask fillet width (µm) | With solder mask thickness lower 50 µm | J | ≥100 | On request |
| Solder mask clearance to copper (µm) | K | ≥50 | ≥25 |
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| Coverlay clearance to copper (µm) | L | ≥150 | ≥100 |
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| Material thicknesses (µm) |
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| Thickness of flexible polyimide (adhesiveless) | Preferably with rolled copper | Thickness: 25 - 150, Copper: 12 - 35 | Copper: 9 ED-Copper, or Copper ≥70 |
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| Thickness of coverlay | DuPont FR or LF (preferably FR) | 25, 38, 50, 75, 100, 150 | ||
| Thickness of acrylic adhesive for reinforcement (thermosetting) | DuPont FR or LF (preferably FR) | 25, 50, 75 | ||
| Thickness of acrylic adhesive for reinforcement (transfer adhesive) | 3M transfer adhesive | 50 o. 130 | ||
| Thickness of reinforcement | FR4 or Coverlay | Coverlay 25 - 150, FR4 50 - 3200 | ||
| Bending |
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| Minimum bending radius² single bend (mm) | Coverlay | Thickness of flexible area X 1 | On request |
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| Minimum bending radius² 4-12 cycles (mm) | Coverlay | Thickness of flexible area X 6 | On request |
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| Minimum bending radius² dyn. stress (mm) | Coverlay | Thickness of flexible area X ≥ 10 | On request |
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| Minimum bending radius² 4-12 cycles (mm) | Flexible solder mask | ≥ 1,50 mm | On request |
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| Other options are possible. Your layer structure is not standard? We will be happy to help you. |
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| ¹Distance from hole to hole: the measure refers to the distance between holes with equal electric potential. The minimum for holes with different potentials results from the minimum annular ring and the minimum conductor spacing. |
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| ²Bending radius: thickness of flexible area = addition of all materials (coverlay, adhesive, copper, base material). The information is only valid for a flexible core with maximum two copper layers. |
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| VERSION: ILFA DFL 1 |
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Download ILFA Design rules for single- and double-sided flexible PCB's.