The technological demands on electronic assemblies are growing steadily. Already for years the PCB is no longer pure wiring of individual components, it is becoming more and more an active part of the entire PCB Assembly. The embedding of chips in the form of bare-dies is already introduced to the large series market. Despite this, the PCB industry recognizes a significant bottleneck in the availability of suitable, embeddable components. In the field of prototype to medium series manufacturing however, the embedding of active and passive SMD components is attracting increasing interest (Figure 1). The advantage over conventional assemblies is a higher degree of miniaturization. The components are also protected against harmful environmental conditions, are mounted tamper-proof and can be electromagnetically shielded by the surrounding copper. In addition, with appropriate design of short signal paths, parasitic effects can be greatly limited or the heat dissipation can be improved significantly. By using SMD components, no costly adaptation of the supply chain or the component specification is necessary. Through various research and customer projects since 2000, ILFA has gained many years of experience with embedding technology. Among other solutions, we have also developed a reliable embedding strategy for "larger" Gull-Wing connections (Figure 2). We will be happy to advise you on embedding and other special technologies from ILFA at our booth 3-349 in hall 3.
Autor: Johannes Blum